![](/Assets/userfiles/sys_eb538c1c-65ff-4e82-8e6a-a1ef01127fed/images/xswyh/Zhang%20Guangming.jpg)
Guangming Zhang
Reader in Ultrasonic Engineering, School of Engineering, Faculty of Engineering and Technology, Liverpool John Moores University,
Byrom Street, Liverpool, L3 3AF, United Kingdom
Tel: +44-151-2312018 (office)
Email: g.zhang@ljmu.ac.uk
Introduction
Guangming Zhang is an associate professor at the School of Engineering at Liverpool John Moores University, UK. He received his Ph.D. degree from the School of Mechanical Engineering, Xi'an Jiaotong University in 1999. In September 1999, he entered the post-doctoral mobile station of the Institute of Acoustics of Nanjing University. From 2001 to 2004, he worked in the Signals and Systems Research Group of Uppsala University, Sweden. He joined Liverpool John Morris University in 2004 and has worked since then.
Since 1993 he has been conducting research in ultrasonic non-destructive testing, including scanning acoustic microscopy, ultrasonic signal/image processing and acoustic modeling, and has published more than 100 academic papers. He has won two third prizes of the State Education Commission's Science and Technology Progress Award, an overseas review expert of China's National Natural Science Progress Award, and a distinguished professor and doctoral supervisor of Xi'an University of Science and Technology. Since 2003, as a founding member of the Electrical and Ultrasonic Engineering (EUE) research group at Liverpool John Morris University, UK, he has been working on the research on micro-nano non-destructive testing and evaluation of the reliability of microelectronic chips. The research project was awarded the UK EPSRC fund , the British Newton Fund, the European Union Fund and the Natural Science Foundation of China, and the research results have been widely recognized by academia and industry. Current main research interests include: green electronics, micro-nano nondestructive evaluation of reliability of microelectronic chips, Prognostics and Health Monitoring of Electronics System, three-dimensional acoustic microscopy imaging, failure analysis and construction of microelectronic chips based on AI and acoustic microscopy imaging die, and lifetime prediction of microelectronic chips.